The Titanium M6 5G will connect with real live assistants instead of a digital one
The Snapdragon 865 Mobile Platform will be manufactured by Samsung using its 7nm EUV process. The 7nm refers to the number of transistors that can fit inside the chip; the smaller the number, the more transistors are inside. And with more transistors inside, the more powerful and energy-efficient these integrated circuits are. Consider that the version of Huawei’s Kirin 990 chipset with an enabled 5G modem is stuffed with 10.3 billion chips inside. Both TSMC and Samsung expect to manufacture 5nm chips by next year; such chips will contain 171.3 million transistors per square millimeter. TSMC and Samsung have roadmaps that take them to the 3nm process as soon as 2022. TSMC is reportedly working on ways to keep Moore’s Law alive. This is the observation made by Intel co-founder Gordon Moore that calls for the number of transistors in integrated circuits to double every other year. The Taiwan based manufacturer is looking at ways to mount transistors vertically instead of side-by-side to squeeze more inside a chip. It is also looking for other materials to replace the silicon used to produce integrated circuits.
The EUV part of the 7nm EUV process stands for extreme ultraviolet lithography. This is a technology that uses ultraviolet beams to more precisely mark up a chip for transistor placement. The more precise and fine these markings can be made, the higher the number of transistors that can be placed inside.